Wafer Dicing Services

If you are in need of wafer dicing services, you've come to the right place. MPE, Inc., offers a variety of cutting and dicing services for your needs, including mechanical sawing and dicing. In addition to standard dicing processes, we also offer custom scribing, die singulation, and wax mounting. All of these services require careful attention to detail.

Dicing processes are automated processes that separate semiconductor wafers into individual die. Depending on the material, dicing processes require varying dicing blade thicknesses and materials. Our specialized service includes wafer inspection and die sorting. We also ship sliced wafers using tape hoop, gel-pak, or waffle-pack packaging. We also have the equipment to process all different types of semiconductor materials, including high-tech materials.

In most cases, dicing services are performed by experts. After reviewing the customer's requirements, a production manager develops a processing plan using decades of experience and an extensive database of previous jobs. Once the material is ready, it is mounted on the dicing saw, dressed and programmed. A machine then slices the wafer to the specifications you provide. The finished product is then washed in a high-pressure spin washer and sent to quality assurance (QA) for inspection.

Dicing processes are a crucial part of manufacturing semiconductor devices. As wafers become smaller and more complicated, circuit density increases. Thin silicon wafers and die attach films add complexity to manufacturing processes. To handle these challenges, you need to have an expert team and world-renowned equipment. Disco is equipped to handle both small and large scale dicing jobs, and we welcome test cuts and special requests. Moreover, we take measures to ensure that your dicing process is error-free and complies with your specifications.

In recent years, the market for thin semiconductor dies has grown rapidly. The production of thin wafers has become a critical competency for many device makers. The use of precision diamond dicing blades allows us to achieve precise dicing tolerances of 75 micrometers or 0.003 inches. The result is a product with a very high quality, a lower cost, and a lower risk of failure.

Dicing services also help manufacturers prepare wafers for shipment. These services include preparing the wafers for shipping. The final step in wafer dicing is to slice the wafers into pieces that can be sold to electronics companies. With the right equipment, a good-quality die dicing service will help ensure a high-quality wafer for your company. The right dicing service will ensure a high-quality product and minimize the risk of rejections.

Dicing is a critical step in semiconductor production. Dicing can be performed by breaking, sawing, and laser cutting. It is often used in the semiconductor industry to produce chips for computer and cell phones. Once the chip is ready, it is placed in a wafer package for further processing. If you're in the process of creating new devices, Dicing is a crucial step. Once you have a finished product, you can use it for many different applications.